Production process for gas purification
Special gases can be classified in many ways, for example, according to the chemical composition of the gas itself, it can be divided into seven categories: silicon, arsenic, phosphorus, boron, metal hydride, halide and metal hydrocarbons. According to its role in integrated circuits, it can be divided into seven categories: adulterated gas, extended gas, ion injection gas, light emitting diode gas, carbide gas, chemical vapor deposition (CVD) gas, and transport diluted gas. At the same time, there is a cross between the above classification, for example, silicon tetrachloride (SiCl4) is both a silicon-based gas and an epitaxial gas, and there are applications in chemical vapor deposition (CVD). The main production processes of special gases include gas synthesis, gas purification, gas mixing, gas cylinder treatment, gas filling, gas analysis and testing. Gas synthesis is the chemical reaction of raw materials under specific pressure, temperature, catalyst and other conditions to obtain crude gas products. Gas purification is the refining of crude products into products of higher purity by means of distillation, adsorption and so on.
What is Purification?
Gas mixture is the mixture of two or more effective component gases in accordance with a specific proportion to obtain a multi-component uniform distribution of gas mixture. Tank handling is the process of treating the interior, inner surface and exterior of the cylinder according to the different properties and requirements of the carrying gas, to ensure the stability of the product during gas storage and transportation. Gas filling refers to the filling of gas into a pressure vessel such as a cylinder through a pressure difference; Gas analysis and detection is the process of analyzing and detecting the composition of gas. Water vapor, oxygen and other impurities in the electron special gas easily cause an oxide film to form on the surface of the semiconductor, affecting the service life of the electronic device, and the particles containing impurities will cause short circuits and circuit damage. With the continuous development of the semiconductor industry, the production accuracy of products is becoming more and more advanced. In the case of integrated circuit manufacturing, for example, the electrical circuit width has gone from the millimeter level at the beginning of Z to the micron level and even the nanoscale, and higher requirements have been put forward for the purity of electronic special gases used in semiconductor production.
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